A good real terminal
ethan.dicks at usap.gov
Thu Apr 17 18:58:42 CDT 2008
On Thu, Apr 17, 2008 at 10:33:14PM +0100, Tony Duell wrote:
> > I think I had to resort to heating one side of the board and sucking the
> > solder from the other side - much easier with the board in a vise.
> Isn't that how you're supposed to do it? It's certainly how I clean out
> PCB holes if I need to add extra chips to a wave-soldered board.
For non-difficult vias, I typically apply heat and suction from the
same side - less juggling. I am accustomed to good results with this
technique (and can commonly recover intact parts from intact boards,
if that's the goal, like the time I extracted an IM6120 from a DecMate III
board - I wanted _both_ to survive so I could mount a socket and replace
the CPU later).
I find I only have to do the double-sided technique with tiny vias or
vias that are tied to inner fill layers (Vcc and GND, typically).
Ethan Dicks, A-333-S Current South Pole Weather at 17-Apr-2008 at 23:50 Z
South Pole Station
PSC 468 Box 400 Temp -76.5 F (-60.3 C) Windchill -110.5 F (-79.1 C)
APO AP 96598 Wind 8.5 kts Grid 106 Barometer 680.2 mb (10621 ft)
Ethan.Dicks at usap.gov http://penguincentral.com/penguincentral.html
More information about the cctalk