Minimal CP-M SBC design

[Roy J. Tellason]

On Saturday 10 May 2008 12:17, Chuck Guzis wrote:
> > Date: Fri, 9 May 2008 10:59:35 -0700 (PDT)
> > From: "Eric Smith"
> >
> > The lead pitch of shrink DIP packages is 0.070 inch (1.78 mm).  I
> > haven't seen any 0.050 (1.27 mm) inch DIPs.  Shrink DIPs were popular
> > with Japanese semi companies, but never caught on very well with US
> > companies, most of which skipped those and went straight to PLCC and
> > PQFP packages.
>
> Right you are--I dug out a couple of shrink DIPs and they are indeed
> 0.070 inch.  Unless you're going right to PCB, these are a real pain
> to deal with today--hard to find sockets, odd spacing, etc.  I think
> I've still got a couple of 64180s in this package kicking around
> somewhere.
>
> Thanks for the correction.

I haven't measured them but I do have about four or so HD6303Y (Hitachi CMOS 
68xx variant with bunches of built-in peripheral stuff) that's in a package 
like that.  I managed to score *one* socket of the wire-wrap variety as a 
sample at some trade show I was at years ago,  but am not 100% sure that it's 
standard 0.025" wrap posts,  in which case I'm still screwed on being able to 
do anything with them.

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