Minimal CP-M SBC design
Roy J. Tellason
rtellason at verizon.net
Sat May 10 19:52:38 CDT 2008
On Saturday 10 May 2008 12:17, Chuck Guzis wrote:
> > Date: Fri, 9 May 2008 10:59:35 -0700 (PDT)
> > From: "Eric Smith"
> > The lead pitch of shrink DIP packages is 0.070 inch (1.78 mm). I
> > haven't seen any 0.050 (1.27 mm) inch DIPs. Shrink DIPs were popular
> > with Japanese semi companies, but never caught on very well with US
> > companies, most of which skipped those and went straight to PLCC and
> > PQFP packages.
> Right you are--I dug out a couple of shrink DIPs and they are indeed
> 0.070 inch. Unless you're going right to PCB, these are a real pain
> to deal with today--hard to find sockets, odd spacing, etc. I think
> I've still got a couple of 64180s in this package kicking around
> Thanks for the correction.
I haven't measured them but I do have about four or so HD6303Y (Hitachi CMOS
68xx variant with bunches of built-in peripheral stuff) that's in a package
like that. I managed to score *one* socket of the wire-wrap variety as a
sample at some trade show I was at years ago, but am not 100% sure that it's
standard 0.025" wrap posts, in which case I'm still screwed on being able to
do anything with them.
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