RoHS nonsense, was: Desoldering Chips, was Re: Can someone,
wdonzelli at gmail.com
Sat Apr 10 16:57:23 CDT 2010
> With BGAs, you don't have leads, so after a couple of thermal shifts most of
> the solder joints will have sheared off the board.
The little solder ball blob (the B in BGA) is there specifically to
act as a cantilever to absorb stresses. IBM figured this out when they
pioneered the technology in the 1960s. Without the tiny amount of give
that the ball gives, failures would be so frequent that the devices
would be useless, especially in today's world of relatively high
power, small outline devices that are constantly going to sleep and
> I can see a huge spike in the amount of electroscrap sent off for disposal:
> solder failures and so on. You can argue that the lack of lead makes it
> "safer", but there are still other things in the plastic cases and PCBs that
> -- AIUI -- are much more harmful than the lead in the solder.
PCBs? They have pretty much been out of the picture for a long time.
Scrap plastic cases are now a resource - in China, scrap plastic is
currently worth more than scrap steel.
> Fact is, the Eurocrats decided they needed to look like they were doing
> something, so they passed an ill-thought-out monstrosity of a law...
For all the pissing and moaning about RoHS solder, the reliability
numbers really do not show a sky-is-falling disaster. If it did, world
economies would be collapsing.
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