tothwolf at concentric.net
Sun Aug 30 19:21:29 CDT 2015
On Sun, 30 Aug 2015, Chuck Guzis wrote:
> On 08/30/2015 09:47 AM, Tothwolf wrote:
>> If repair of the core memory in CHM's IBM 1620 is ever attempted, I
>> think either low-tin solder alloy with 1-2% added copper or possibly
>> a more modern indium-lead solder alloy would probably be the best
>> choice for the enamel wire to terminal connections since that would
>> greatly reduce the likelihood of any future wire breakage.
> Wouldn't solderless bonding/welding be a better alternative?
Yes, if the terminals had been designed for that. The terminals on these
would have been designed for soldering, so unless you wanted to replace
all the existing terminals, it would probably be best to stick to
soldering. Either a low-tin + copper or non-tin solder really should solve
the problem anyway.
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