Stuffing boards with pulled QFP chips

Jon Elson elson at
Sat Apr 1 12:03:25 CDT 2017

On 04/01/2017 11:19 AM, Chuck Guzis via cctalk wrote:
> BGA, on the other hand, is something that I haven't 
> mastered--and I doubt that I ever will, given the small 
> size of some of the parts.

Yes, I'm with you.  if I get bad soldering on a leaded 
flat-pack, I can poke the leads with an X-acto knife to find 
the ones that wiggle, and then touch up the soldering and 
test again.  With a BGA or leadless package, there's no easy 
way to detect or fix bad soldering.


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