Which DEC machine made use of th pre Flip-Chip board?
wdonzelli at gmail.com
Fri Dec 21 16:40:01 CST 2018
> The original "Flip Chip" was a packaging failure. It was literally a die bonded to a PCB
> and never went into production.
> I think it is mentioned in "Computer Engineering"
> IBM perfected the techniques to do this later with the development of solder bumps and
> IR reflow.
Are you talking about the little black rectangles, sort of SIP
packages, DEC tried in the late 1960s? They were a disaster with
reliability, but they did ship.
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