Which DEC machine made use of th pre Flip-Chip board?

Jon Elson elson at pico-systems.com
Fri Dec 21 22:02:59 CST 2018

On 12/21/2018 10:51 AM, Al Kossow via cctalk wrote:
> On 12/21/18 5:19 AM, Noel Chiappa via cctalk wrote:
>> The DEC brochure for it (P5141) is a little puzzling; it says (p. 2) that
>> "INTEGRATED CIRCUITS are basic elements of the low cost, newly designed
>> silicon FLIP CHIP modules used throughout PDP-7", but AFAIK, the first FLIP
>> CHIPs (R-series, B-series, etc) were all transistors; the later M-series were
>> the first ones to have ICs. Maybe this is some old meaning of "integrated
>> circuits"?
> The original "Flip Chip" was a packaging failure. It was literally a die bonded to a PCB
> and never went into production.
> I think it is mentioned in "Computer Engineering"
> IBM perfected the techniques to do this later with the development of solder bumps and
> IR reflow.
The 360 was announced in 1964, first delivered in 1965, 
using "flip chip" bonding of discrete transistors and diodes 
on ceramic substrates, their "SLT" packaging.  So, I'm not 
too sure about the "later".  The original PDP-8 was 
introduced in 1965.


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