On 03/31/2017 06:15 PM, Jon Elson via cctech wrote:
  I have a project I do from time to time using 128-lead
14mm TQFPs
 with 0.4mm lead spacing. I use a stereo zoom microscope with a
 home-made LED ring light. First, I rub the pads with a pencil eraser
 to remove oxidation caused by reflow temps on the rest of the board.
 I put a tiny dab of solder on two pads at opposite corners. I then
 place the chip in place and reflow those pads.  If the alignment is
 not good enough, I can "walk" the chip a bit by reflowing one, then
 the other pad.  Then, I apply liquid flux to the rows of leads with
 a wire dipped in the flux. And, then solder down the rows with a
 fine-tip soldering iron.  If a bridge develops, solder wick fixes
 it. 
There are plenty of good Youtube videos describing this.  I use pretty
much the same method, but start off with just a binocular loupe and then
finish with a stereo microscope for final inspection.
The soldering  iron tip that works best for me is a rather broad chisel
tip.  I leave the fine tips for other work.
--Chuck